KEMET Introduces KONNEKT Technology Enabling Higher Power Densities in Smaller Form Factors

 

GREENVILLE, S.C., March 01, 2018 (GLOBE NEWSWIRE) -- KEMET Corporation (NYSE:KEM), a leading global supplier of electronic components, today announced new patented KONNEKT technology enabling high power density by combining multiple components into a single surface mountable package. This technology is designed for use by power electronics engineers where high-power density in a small form factor is critical.

KEMET KONNEKT Technology
  KEMET KONNEKT technology enables higher power densities in smaller form factors.

 

Developed in partnership with prominent power electronics designers to create a leadless multichip solution for high-efficiency and high-density power converters, KONNEKT technology utilizes innovative transient liquid phase sintering (TLPS). These devices can be mounted to PCBs using existing reflow processes. Capacitors utilizing KONNEKT technology have the unique ability to be mounted in a low-loss orientation to further increase their power handling capability.

The first release of KONNEKT technology will combine KEMET’s ultra-stable U2J dielectric to create a low-loss, low-inductance package capable of handling very high ripple current in the hundreds of kilohertz range. KEMET will deploy this advanced RoHS compliant, 100% Pb-free technology across multiple product platforms.

“Power electronics engineers asked for a solution to help achieve higher efficiency in smaller packages,” said Dr. John Bultitude, KEMET Vice President and Technical Fellow. “KEMET’s KONNEKT technology delivers through increased efficiency by combining multiple capacitors into a single high density, ultra-low loss package.”

About KEMET

KEMET Corporation is a leading global manufacturer of electronic components that meet the highest standards for quality, delivery and service. The company offers its customers the broadest selection of capacitor technologies in the industry, along with an expanding range of sensors, actuators, and electromagnetic compatibility solutions. KEMET operates manufacturing facilities, sales and distribution centers around the world. The company’s common stock is listed on the NYSE under the symbol “KEM.” Additional information about KEMET can be found at www.kemet.com.

Cautionary Statement on Forward-Looking Statements

Certain statements included herein contain forward-looking statements within the meaning of federal securities laws about KEMET Corporation’s (the "Company") financial condition and results of operations that are based on management's current expectations, estimates and projections about the markets in which the Company operates, as well as management's beliefs and assumptions. Words such as "expects," "anticipates," "believes," "estimates," variations of such words and other similar expressions are intended to identify such forward-looking statements. These statements are not guarantees of future performance and involve certain risks, uncertainties and assumptions, which are difficult to predict. Therefore, actual outcomes and results may differ materially from what is expressed or forecasted in, or implied by, such forward-looking statements. Readers are cautioned not to place undue reliance on these forward-looking statements, which reflect management's judgment only as of the date hereof. The Company undertakes no obligation to update publicly any of these forward-looking statements to reflect new information, future events or otherwise.

Certain risks and uncertainties that could cause actual outcome and results to differ materially from those expressed in, or implied by, these forward-looking statements are described in the Company’s reports and filings with the Securities and Exchange Commission.

Contact:  Dr. John C. Boan
Vice President, Marketing
johnnyboan@kemet.com
954.766.2813

A photo accompanying this announcement is available at http://www.globenewswire.com/NewsRoom/AttachmentNg/1cb4f1fe-328f-4f58-a5a9-677a13363cb3

Primary Logo

 

Source: KEMET Corporation